Instrument Specification
The MA6 mask aligner was designed to pattern parts of thin films using optical lithography. It uses light to transfer a geometric pattern from a photomask to a light-sensitive chemical "photoresist", or simply "resist," on the substrate.
The Karl Suss MA6 is one of the most reliable mask aligners in the industry with a minimal maintenance cost. It works with substrates up to 150mm in diameter. The exposure wavelength is UV400 (range 350- 450 nm). Two exposure intensity channels are supplied over which the user can vary the exposure time for proper image sharpness.
A Bottom Side Alignment option allows patterning on both sides of the substrate.
Automatic wedge compensation can be used to ensure that the mask and the wafer are parallel. Z-axis is motorized, and the gap between mask and wafer is programmable from 0 to 300 microns.
Several contact modes are available, for which the space resolution is as following:
Contact mode | Space Resolution |
---|---|
Vacuum Contact | < 0.8 μm |
Hard Contact | 1.0 μm |
Soft Contact | 2.0 μm |
Proximity | 2.5 μm |
Training information
- 2-4 hours training, depends on customer needs.
- No Prerequisites. Verbal explanation & SOP on MA6 operation principles: safety, turn on/off, microscope operation, operator menu, front side / back side alignment. Trainee’s hands-on under my supervision.
Location
Staff Contacts
-
Leonid Tunik
מהנדס אלקטרוניקה
Training information
2-4 hours of training (depends on customer needs)
No Prerequisites.
Verbal explanation accompanied with SOP manual on MA6 operation principles:
- Safety
- Turn on/off
- Microscope operation
- Operator menu
- Front side/back side alignment.
- Trainee's hands-on under a tool owner's supervision.