This is a compact plasma treatment bench-top configuration system designed for a wide variety of plasma cleaning, surface activation and adhesion improvement applications. 

A system chassis houses the plasma chamber, control electronics, 13.56 MHz RF generator, and the automatic matching network 

Features

• Automated process control. 
• RF Power: 300 W 13.56 MHz with auto-matching 
• Controlled gas control for: Ar, O2, N2 

Applications

• Surface activation. 
• Surface cleanining. 
• Pre-die attach for enhanced die adhesion 
• Pre-wire bonding for improved wire bonds 
• Pre-mold & encapsulation for reduced delamination 
• Pre-flip chip underfill (FCUF) for faster, void-free fluid flow, improved filet height and uniformity, and better adhesion of the underfill material.

Training information

• 0.5 hour