Wire bonding is a method of interconnecting between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can connect an IC to other electronics or connect from one printed circuit board (PCB) to another. Wire bonding is considered the most cost-effective and flexible interconnect technology to assemble most semiconductor packages. Wire bonding can be used at frequencies above 100 GHz 

Features

• Wedge and Ball bonding capabilities. 
• 17 microns to 75 microns Wire  
• Deep-Access Bond Head 16 mm 
• 6.5’’ TFT touch screen 
• Bond Arm Length 165mm 
• Motorized z-axis 
• Electronic Ball Size Control 

Consumables

• Every group gets a wedge and or capillary to support its bonding process and needs to order it by the internal system in the Nanofab supplies: link